On June 24, Columbia School of Engineering and Applied Science invites you to How is A.I. Shaping our World? panel discussion in Beijing, to hear from experts on the enormous potential AI will have to dramatically impact lives, from finance to transportation to healthcare. It will be the partnerships between academia and industry that drives the improvement and further development of AI. Both the US and China are well positioned to use big data, new technologies and talent to dominate the global market.
The event is supported by Columbia Global Centers | Beijing.
Mary C. Boyce, Dean of Engineering at The Fu Foundation School of Engineering and Applied Science at Columbia University
Shih-Fu Chang, Senior Executive Vice Dean, Richard Dicker Professor of Telecommunications, and Professor of Electrical Engineering and of Computer Science at Columbia University
Yaqin Zhang, President at Baidu Inc.
Qi Yin, Co-founder and CEO of Megvii Technology Inc., alumnus of Columbia University
Hod Lipson, Professor of Mechanical Engineering and Data Science, and Director of the Creative Machines Lab at Columbia University
The event will be conducted in English.
Due to limited seats, registration will be verified through the QR code of confirmation. Please present the QR code at the entrance.
Please plan to arrive no earlier than the registration time and no later than 20 minutes after the end of registration period.
If you are unable to attend the event, please inform us in advance.
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