Events

Past Event

Shanghai Panel: How is A.I. Shaping our World?

June 22, 2018
6:00 PM - 8:00 PM
Morgan Stanley Tech, Kerry Parkside, 1155 Fang Dian Road, Shanghai

Is A.I. the new industrial revolution? 

On June 22, Columbia School of Engineering and Applied Science invites you to How is A.I. Shaping our World? panel discussion in Shanghai, to hear from experts on the enormous potential AI will have on our lives, from finance to transportation to healthcare. It will be the partnership between academia and industry that will drive the improvement and further development of AI. Both the US and China are well positioned to use big data, new technologies and talent to dominate the global market.

The event is supported by Columbia Global Centers | Beijing.

 

Speakers

Mary C. Boyce, Dean of Engineering at The Fu Foundation School of Engineering and Applied Science at Columbia University

Xiaolu Ye '98, Executive Director at Morgan Stanley

Hod Lipson, Professor of Mechanical Engineering and Data Science, and Director of the Creative Machines Lab at Columbia University

 

Special Notice
  • The event will be conducted in English.

  • Due to limited seats, registration will be verified through the QR code of confirmation.

  • If you have any questions, please leave us a message below or email to beijing.cgc@columbia.edu.